Soldering Station Motherboard Repair Tool Set for iPhone / Android
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Soldering Station Motherboard Repair Tool Set for iPhone 6 7 8 Plus X XS Max Mobile Phone CPU NAND Layered Heating Patform
- for iPhone 5-8 Plus X XS XSMax upper / lower motherboard heating station.
- Special heating design and precise temperature control capability, which will locate accurately locate the needed heating part.
- Dual bayonet design to make motherboard stable.
- Using high purity copper to guarantee heat transfer, which is not easy for deformed, durable and anti-wear.
- Adopting 185-degree layered process to remove the IP motherboard, not only from our fine analysis of IP solder paste ,but depends on the special heating design and precise temperature control of SS-T12A.
Only heating the area that the IP board needs to be removed to prevent improper heating.
- T12A-X3 (For iPhone X/XS/MAX Mainboard Layered)
- T12A-Face (For iPhone X/XS/MAX Face ID Maintenance)
- T12A-CPU (For CPU NAND IC Glue Clean)
- T12A-F (For iPhone X/XS/MAX Fingerprint ID Maintenance)
- T12A-Android (For Android Mobile Phone Mainboard Heating Station)
- T12A-XF (For Phone X/XS/MAX/XR Middle Frame Remove Heating Station)